Technology

How JAX-BTE works, from quadrature to chip.

A complete walkthrough of the physics, the solver, the surrogates, and the coupling that makes chip-scale ballistic thermal modeling practical.

01 · The physics

Why Fourier fails at advanced nodes

Phonon mean free path in silicon is ~40 nm at 300 K. Modern FinFET fin widths are under 10 nm. Heat carriers traverse the device ballistically — there is no diffusive regime to average over. Fourier's law, derived from a diffusive assumption, is not just imprecise here. It is the wrong physics.

Through-thickness temperature profile: Fourier vs. phonon BTE for a 5 nm fin.
Through-thickness temperature profile: Fourier vs. phonon BTE for a 5 nm fin.

02 · The solver

GPU-native tensor architecture

JAX-BTE stores phonon energy distributions as 3D tensors (spatial cells × spectral bands × angular directions) and solves on the GPU via vectorized JAX operations. Discrete ordinates method with Gauss-Legendre quadrature; non-gray band discretization; pseudo-time iteration with a BiCGSTAB linear solver. Up to 100 M degrees of freedom on a single A100.

End-to-end JAX-BTE workflow — geometry to temperature field via fully differentiable solve.
End-to-end JAX-BTE workflow — geometry to temperature field via fully differentiable solve.

03 · Performance

8× faster, on commodity GPUs

29 seconds on a single RTX 4090 to solve a 1 M DoF problem that takes 243 seconds across 8 CPU cores in the prior state-of-the-art (GiftBTE). The advantage grows with problem size up to GPU memory limits.

Speedup vs problem size — single-GPU JAX-BTE against multi-CPU GiftBTE.
Speedup vs problem size — single-GPU JAX-BTE against multi-CPU GiftBTE.

04 · Inverse design

Gradients through every step

Because JAX-BTE is end-to-end differentiable — including the BiCGSTAB linear solve, via discrete adjoints — gradients flow through the entire solver. Recover film thicknesses in 25 iterations. Recover 2D heat source intensities in 10. From 20 sparse temperature observations. No other phonon BTE solver does this.

Inverse recovery of heat source intensity from sparse temperature observations.
Inverse recovery of heat source intensity from sparse temperature observations.

05 · Multiscale coupling

Sub-10 nm physics, chip-scale simulations

Direct BTE everywhere is intractable at chip scale. SOLDER decomposes the problem: BTE-accurate operator-learning surrogates in transistor regions where ballistic transport matters; spectral-kernel surrogates over the substrate where Fourier holds. Iterative boundary-condition exchange closes the loop. 7× speedup over full BTE, 74% memory reduction, sub-1 K error.

SOLDER multiscale coupling — operator-learning surrogates exchange boundary conditions.
SOLDER multiscale coupling — operator-learning surrogates exchange boundary conditions.

References

Published, patented, and reproducible.

The full method is described in our paper in npj Computational Materials. The end-to-end system is protected under PCT/US25/36027.